LEED
Awards
The development of a new 909,170 SF, three-building corporate campus. Design called for the partial demolition of an existing 2-story chip-testing facility and reinforcement of the remaining portion which was originally designed by Burkett & Wong Engineers in the late 1990’s. The new 12-story, 411,950 SF engineering office facility was constructed using steel moment frames, housing various offices, conference rooms and an auditorium on the ground floor. A new 2-story central plant and cogeneration facility was also designed to accommodate the energy and power requirements of this new campus.



